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ClampTM 6-Line ESD protection Array
PROTECTION PRODUCTS - MicroClampTM Description
The ClampTM series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed for use in applications where board space is at a premium. Each device requires less than 2.6mm2 of PCB area and will protect up to six lines. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The UCLAMP0506P is in a 6-pin, RoHS/WEEE compliant, SLP1616P6 package. It measures 1.6 x 1.6 x 0.60mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). The combination of small size, low capacitance, and high ESD surge capability makes them ideal for use in portable electronics such as cell phones, PDAs, notebook computers, and digital cameras.
UCLAMP0506P
Features
Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Protects six I/O lines Ultra-small package (1.6 x 1.6 x 0.6mm requires 0.6mm) 1.6 2 less than 2.6mm of PCB area Working voltage: 5V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP1616P6 6L package RoHS/WEEE Compliant Nominal Dimensions: 1.6 x 1.6 x 0.60 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking: 0506P Packaging: Tape and Reel per EIA 481
Applications
Cellular Handsets and Accessories Cordless Phones Personal Digital Assistants (PDAs) Portable Instrumentation Digital Cameras Peripherals MP3 Players
Circuit Diagram
PIN Configuration
1.6
1
2
3
4
5
6
1
1.6
6
0.5 0.6
Center Pad
SLP1616P6 (Bottom View) Nominal Dimensions in mm
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Revision 04/17/2007
UCLAMP0506P
PROTECTION PRODUCTS Absolute Maximum Rating
R ating Peak Pulse Power (tp = 8/20s) Maximum Peak Pulse Current ( tp = 8/20s) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Pp k Ip p V PP TL TJ TSTG Value 100 7 +/- 20 +/- 12 260 (10 sec.) -55 to +125 -55 to +150 Units Watts Amps kV C C C
Electrical Characteristics (T=25oC)
Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Reverse Leakage Current Clamping Voltage Clamping Voltage Clamping Voltage Clamping Voltage Junction Capacitance Symbol VRWM V BR IR IR VC VC VC VC Cj It = 1mA VRWM = 5V, T=25C VRWM = 3V, T=25C IPP = 1A, tp = 8/20s Any I/O to Ground Pad IPP = 1A, tp = 8/20s I/O to I/O IPP = 7A, tp = 8/20s Any I/O to Ground Pad IPP = 7A, tp = 8/20s I/O to I/O Between I/O Pins and Gnd VR = 0V, f = 1MHz Between I/O Pins and I/O Pins VR = 0V, f = 1MHz 60 6 1 0.500 9 10 11 12 75 Conditions Minimum Typical Maximum 5 Units V V A A V V V V pF
Junction Capacitance
Cj
30
40
pF
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Clamp0506P
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
Power Derating Curve
110 100 90 % of Rated Power or I PP 80 70 60 50 40 30 20 10 0
Peak Pulse Power - P PP (kW)
1
0.1
0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Clamping Voltage vs. Peak Pulse Current
12 11 10 Clamping Voltage - Vc (V) 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 Peak Pulse Current - IPP (A) 6 7 8 Waveform Parameters: tr = 8s td = 20s
Line to Gnd Line to Line
Forward Voltage vs. Peak Pulse Current
2.5 Waveform Parameters: tr = 8s td = 20s
2 Forward Voltage - VF (V)
1.5
1
0.5
0 0 1 2 3 4 5 6 7 8 9 10 11 12
Forward Current - IF (A)
Normalized Capacitance vs. Reverse Voltage
1 0.9 CJ(VR) / CJ(VR=0) 0.8 0.7 0.6
ESD Clamping (+8kV Contact per IEC 61000-4-2)
f = 1 MHz
0.5 0 1 2 3 Reverse Voltage - VR (V) 4 5
Note: Data is taken with a 10x attenuator 2007 Semtech Corp. 3 www.semtech.com
UCLAMP0506P
PROTECTION PRODUCTS
ESD Clamping (-8kV Contact per IEC 61000-4-2)
Note: Data is taken with a 10x attenuator
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Clamp0506P
PROTECTION PRODUCTS Applications Information
Device Connection for Protection of Five Data Lines These devices can be configured to protect up to 6 unidirectional data lines or 5 bidirectional lines. The device is connected as follows: 1. Protection of six I/O lines is achieved by connecting pins 1, 2, 3, 4, 5, and 6 to the data lines. The center tab is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. 2. Bidirectional protection of five I/O lines is achieved by connecting and five pins data lines. The remaining pin is connected to ground. The center pad is not connected. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible.
Center Pad 1 2
Circuit Diagram
3 4 5 6
Configuration (Top View) Pin Conf iguration (Top Side Vie w)
1 2 3
6
Gnd
5 4
Pin 1, 2, 3, 4, 5, 6 Center Tab
Identification Input/Output Lines Ground
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UCLAMP0506P
PROTECTION PRODUCTS Applications Information - Spice Model
UCLAMP0506P Spice Model
Table 1 - UCLAMP0506P Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 7.82E-15 7.03 0.73 0.211 1.0E-3 59E-12 2.541E-9 0.25 1.1 1.11
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Clamp0506P
PROTECTION PRODUCTS Outline Drawing - SLP1616P6
A PIN 1 INDICATOR (LASER MARK)
D
B
D1 12 LxN E1 N bxN A SEATING PLANE C e D/2 bbb CAB E/2
DIM
A A1 A2 b D D1 E E1 e L N aaa bbb
E
aaa C A2 A1
.020 .023 .026 0.00 .001 .002 (.006) .007 .010 .012 .059 .063 .067 .041 .047 .051 .059 .063 .067 .010 .016 .020 .020 BSC .013 .013 .016 6 .003 .004
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX
0.50 0.58 0.65 0.00 0.03 0.05 (0.15) 0.20 0.25 0.30 1.50 1.60 1.70 1.05 1.20 1.30 1.50 1.60 1.70 0.25 0.40 0.50 0.50 BSC 0.25 0.33 0.40 6 0.08 0.10
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1616P6
P X
DIMENSIONS DIM B C P F G X Y Z INCHES .051 .060 .020 .018 .035 .012 .025 .085 MILLIMETERS 1.30 1.52 0.50 0.45 0.89 0.30 0.63 2.15
Z
G
F
(C)
Y B
NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET
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UCLAMP0506P
PROTECTION PRODUCTS Marking Code Ordering Information
Part Number Lead Finish Pb Free Qty per Reel 3,000 R eel Size 7 Inch
0506P
uClamp 0506P.TCT
MicroClamp and uClamp are marks of Semtech Corporation
Tape and Reel Specification
Pin 1
Device Orientation in Tape
A0 1.78 +/-0.05 mm
B0 1.78 +/-0.05 mm
K0 0.69 +/-0.05 mm
Tape Width
B, (Max)
D
D1
E
F
K (MAX)
P
P0
P2
T(MAX)
W 8.0 mm + 0.3 mm - 0.1 mm
8 mm
4.2 mm
1.5 + 0.1 mm - 0.0 mm )
0.5 mm 0.05
1.750.10 mm
3.50.05 mm
2.4 mm
4.00.1 mm
4.00.1 mm
2.00.05 mm
0.4 mm
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2007 Semtech Corp.
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